Invention Grant
- Patent Title: Electrical connector with improved retention structures
- Patent Title (中): 具有改进的保持结构的电连接器
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Application No.: US12075152Application Date: 2008-03-10
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Publication No.: US07674139B2Publication Date: 2010-03-09
- Inventor: Fang-Chu Liao , Shuo-Hsiu Hsu
- Applicant: Fang-Chu Liao , Shuo-Hsiu Hsu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Main IPC: H01R13/502
- IPC: H01R13/502

Abstract:
An electrical connector (100) for electrically connecting with a chip module and a printed circuit board comprises a plurality of insulative housings (1), a plurality of contacts received in the insulative housing, and a frame (2) defining an accommodating space (26) to accommodate the insulative housings. The frame defines continuous lateral walls (23) and a plurality of enhancing ribs (24) extending from the lateral walls into the accommodating space. A plurality of first rivet sections (231) are disposed on at least one of the lateral walls of the frame and the insulative housings and a plurality of first mounting holes (16) are defined in at least one of the insulative housings and the lateral walls of the frame to receive the first rivet sections. A plurality of second rivet sections (243) are disposed on at least one of the enhancing ribs of the frame and the insulative housings and a plurality of second mounting holes (17) are defined in at least one of the insulative housings and the enhancing ribs to receive the rivet sections.
Public/Granted literature
- US20080220655A1 Electrical connector with improved retention structures Public/Granted day:2008-09-11
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