Invention Grant
US07674251B2 Medical devices including aerated adhesive bonds and methods of forming the same
失效
包括曝气胶粘剂在内的医疗装置及其形成方法
- Patent Title: Medical devices including aerated adhesive bonds and methods of forming the same
- Patent Title (中): 包括曝气胶粘剂在内的医疗装置及其形成方法
-
Application No.: US10820659Application Date: 2004-04-08
-
Publication No.: US07674251B2Publication Date: 2010-03-09
- Inventor: Gregory S. Kelley
- Applicant: Gregory S. Kelley
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Agency: Crompton, Seager & Tufte, LLC
- Main IPC: A61M25/00
- IPC: A61M25/00
Abstract:
Medical devices can be formed from medical device components that are bonded together with an adhesive that resists stresses caused by adhesive curing. In particular, a medical device can include a first component and a second component. The second component can be configured to fit at least partially over the first component. An aerated adhesive layer can be formed or disposed between the first and second components.
Public/Granted literature
- US20050228360A1 Medical devices including aerated adhesive bonds and methods of forming the same Public/Granted day:2005-10-13
Information query
