Invention Grant
- Patent Title: Processing apparatus
- Patent Title (中): 处理装置
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Application No.: US10576940Application Date: 2004-10-18
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Publication No.: US07674336B2Publication Date: 2010-03-09
- Inventor: Manabu Honma , Yukio Ohizumi , Keisuke Nagatsuka
- Applicant: Manabu Honma , Yukio Ohizumi , Keisuke Nagatsuka
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2003-364335 20031024; JP2003-417833 20031216; JP2004-046729 20040223
- International Application: PCT/JP2004/015369 WO 20041018
- International Announcement: WO2005/041284 WO 20050506
- Main IPC: C23C16/46
- IPC: C23C16/46 ; H01L21/324
Abstract:
A thermal processing apparatus according to the present invention comprises a processing container having an opening part at a lower end thereof. The processing container can contain an object to be processed therein. The opening part can be opened and closed by a lid. A flange is provided at a periphery of the opening part. A gas-introducing part for introducing a gas into the processing container is provided in the flange. The object to be processed contained in the processing container is heated by a heating mechanism.
Public/Granted literature
- US20070075086A1 Processing apparatus Public/Granted day:2007-04-05
Information query
IPC分类:
