Invention Grant
- Patent Title: Gas manifolds for use during epitaxial film formation
- Patent Title (中): 在外延膜形成期间使用的气体歧管
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Application No.: US11697516Application Date: 2007-04-06
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Publication No.: US07674337B2Publication Date: 2010-03-09
- Inventor: David Ishikawa , Craig R. Metzner , Ali Zojaji , Yihwan Kim , Arkadii V. Samoilov
- Applicant: David Ishikawa , Craig R. Metzner , Ali Zojaji , Yihwan Kim , Arkadii V. Samoilov
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C30B11/00

Abstract:
The present invention provides methods, systems, and apparatus for epitaxial film formation that includes an epitaxial chamber adapted to form an epitaxial layer on a substrate; a deposition gas manifold adapted to supply at least one deposition gas and a carrier gas to the epitaxial chamber; and an etchant gas manifold, separate from the deposition gas manifold, and adapted to supply at least one etchant gas and a carrier gas to the epitaxial chamber. Numerous other aspects are disclosed.
Public/Granted literature
- US20070259112A1 GAS MANIFOLDS FOR USE DURING EPITAXIAL FILM FORMATION Public/Granted day:2007-11-08
Information query
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