Invention Grant
- Patent Title: Apparatus to confine plasma and to enhance flow conductance
- Patent Title (中): 用于限制等离子体和增强流动电导的装置
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Application No.: US11531479Application Date: 2006-09-13
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Publication No.: US07674353B2Publication Date: 2010-03-09
- Inventor: Kallol Bera , Daniel Hoffman , Yan Ye , Michael Kutney , Douglas A. Buchberger
- Applicant: Kallol Bera , Daniel Hoffman , Yan Ye , Michael Kutney , Douglas A. Buchberger
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306

Abstract:
The embodiments of the present invention generally relate to a plasma reactor. In one embodiment, a plasma reactor includes a substrate support is disposed in a vacuum chamber body and coupled to bias power generator. An RF electrode is disposed above the substrate support and coupled to a very high frequency power generator. A conductive annular ring is disposed on the substrate support and has a lower outer wall, an upper outer wall and an inner wall. A step is extends upward and outward from a lower outer wall and inward and downward from the upper outer wall. The inner wall disposed opposite the upper and lower outer wall. In other embodiments, the annular ring may be fabricated from a conductive material, such as silicon carbide and aluminum.
Public/Granted literature
- US20070023145A1 APPARATUS TO CONFINE PLASMA AND TO ENHANCE FLOW CONDUCTANCE Public/Granted day:2007-02-01
Information query
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