Invention Grant
- Patent Title: Mechanism for varying the spacing between sputter magnetron and target
- Patent Title (中): 改变溅射磁控管与靶材间距的机理
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Application No.: US10942273Application Date: 2004-09-16
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Publication No.: US07674360B2Publication Date: 2010-03-09
- Inventor: Ilyoung Richard Hong , Donny Young , Michael Rosenstein , Robert B. Lowrance , Daniel C. Lubben , Michael Andrew Miller , Peijun Ding , Sreekrishnan Sankaranarayan , Goichi Yoshidome
- Applicant: Ilyoung Richard Hong , Donny Young , Michael Rosenstein , Robert B. Lowrance , Daniel C. Lubben , Michael Andrew Miller , Peijun Ding , Sreekrishnan Sankaranarayan , Goichi Yoshidome
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Law Offices of Charles Guenzer
- Main IPC: C25B9/00
- IPC: C25B9/00 ; C25B11/00 ; C25B13/00 ; C23C14/00

Abstract:
A lift mechanism for and a corresponding use of a magnetron in a plasma sputter reactor. A magnetron rotating about the target axis is controllably lifted away from the back of the target to compensate for sputter erosion, thereby maintaining a constant magnetic field and resultant plasma density at the sputtered surface, which is particularly important for stable operation with a small magnetron, for example, one executing circular or planetary motion about the target axis. The lift mechanism can include a lead screw axially fixed to the magnetron support shaft and a lead nut engaged therewith to raise the magnetron as the lead nut is turned. Alternatively, the support shaft is axially fixed to a vertically moving slider. The amount of lift may be controlled according a recipe based on accumulated power applied to the target or by monitoring electrical characteristics of the target.
Public/Granted literature
- US20050133365A1 Mechanism for varying the spacing between sputter magnetron and target Public/Granted day:2005-06-23
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