Invention Grant
US07674394B2 Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution 有权
等离子体处理,用于通过气体分布板电感耦合电力,同时调节等离子体分布

Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution
Abstract:
A method of processing a workpiece in the chamber of a plasma reactor includes capacitively coupling plasma source power using a ceiling gas distribution plate as the electrode while inductively coupling plasma source power through the ceiling gas distribution plate, and flowing process gas through the gas distribution plate from a gas input to plural gas injection orifices, distributing the gas flow within the gas distribution plate through a succession of arcuate paths joined at respective junctions, dividing gas flow at each junction from a first respective one of said gas flow paths into a respective pair of said gas flow paths in opposite gas flow directions, and restricting the arcuate length of each of the arcuate paths to less than half-circles.
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