Invention Grant
US07674394B2 Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution
有权
等离子体处理,用于通过气体分布板电感耦合电力,同时调节等离子体分布
- Patent Title: Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution
- Patent Title (中): 等离子体处理,用于通过气体分布板电感耦合电力,同时调节等离子体分布
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Application No.: US11679122Application Date: 2007-02-26
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Publication No.: US07674394B2Publication Date: 2010-03-09
- Inventor: Alexander Paterson , Valentin N. Todorov , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland
- Applicant: Alexander Paterson , Valentin N. Todorov , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Law Office of Robert M. Wallace
- Main IPC: G01L21/30
- IPC: G01L21/30 ; H01L21/00 ; C23F1/00

Abstract:
A method of processing a workpiece in the chamber of a plasma reactor includes capacitively coupling plasma source power using a ceiling gas distribution plate as the electrode while inductively coupling plasma source power through the ceiling gas distribution plate, and flowing process gas through the gas distribution plate from a gas input to plural gas injection orifices, distributing the gas flow within the gas distribution plate through a succession of arcuate paths joined at respective junctions, dividing gas flow at each junction from a first respective one of said gas flow paths into a respective pair of said gas flow paths in opposite gas flow directions, and restricting the arcuate length of each of the arcuate paths to less than half-circles.
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