Invention Grant
- Patent Title: Electroconductive resin composition and molded product thereof
- Patent Title (中): 导电树脂组合物及其成型体
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Application No.: US10581675Application Date: 2004-12-03
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Publication No.: US07674402B2Publication Date: 2010-03-09
- Inventor: Tadashi Iino , Zenichiro Izumi
- Applicant: Tadashi Iino , Zenichiro Izumi
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-407765 20031205
- International Application: PCT/JP2004/018448 WO 20041203
- International Announcement: WO2005/055351 WO 20050616
- Main IPC: H01B1/00
- IPC: H01B1/00
Abstract:
An electroconductive resin composition, comprising at least: a multi-component polymer-type resin binder (A) comprising a dispersed phase and a continuous phase, and having a number-average particle size of dispersed phase of 0.001-2 μm, and an electroconductive material (B) in the form of powder and/or fiber. The electroconductive resin composition may preferably be used for a fuel cell separator.
Public/Granted literature
- US20070114497A1 Electroconductive resin composition and molded product thereof Public/Granted day:2007-05-24
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