Invention Grant
- Patent Title: Positive photosensitive resin composition
- Patent Title (中): 正型感光性树脂组合物
-
Application No.: US12091122Application Date: 2006-10-20
-
Publication No.: US07674566B2Publication Date: 2010-03-09
- Inventor: Satoshi Shibui
- Applicant: Satoshi Shibui
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei EMD Corporation
- Current Assignee: Asahi Kasei EMD Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2005-311248 20051026; JP2006-191014 20060712
- International Application: PCT/JP2006/320965 WO 20061020
- International Announcement: WO2007/049524 WO 20070503
- Main IPC: G03F7/023
- IPC: G03F7/023 ; G03F7/30
Abstract:
The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units. A terpene compound can be combined with a hydroxypolyamide having a particular structure to provide a positive photosensitive resin composition excellent in positive lithography performance such as sensitivity and resolution.
Public/Granted literature
- US20090233228A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION Public/Granted day:2009-09-17
Information query
IPC分类:
