Radio frequency identification (RFID) tag lamination process using liner

Invention Grant

US07674649B2 Radio frequency identification (RFID) tag lamination process using liner 失效

Title translation: 使用衬垫的射频识别（RFID）标签层压工艺

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Patent Title: Radio frequency identification (RFID) tag lamination process using liner
Patent Title (中): 使用衬垫的射频识别（RFID）标签层压工艺
Application No.: US12187143

Application Date: 2008-08-06
Publication No.: US07674649B2

Publication Date: 2010-03-09
Inventor: Robert R. Oberle
Applicant: Robert R. Oberle
Applicant Address: US PA Quakertown
Assignee: RCD Technology Inc.
Current Assignee: RCD Technology Inc.
Current Assignee Address: US PA Quakertown
Agency: Fliesler Meyer LLP
Main IPC: H01L21/00
IPC: H01L21/00

Radio frequency identification (RFID) tag lamination process using liner

Abstract:

A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Abstract(Chinese):

构造RFID单元的方法可以包括使用保护层来将导电粘合剂尚未完全设定的状态下将集成电路芯片模块保持在具有天线单元的基板层上。

Public/Granted literature

US20080311704A1 RADIO FREQUENCY IDENTIFICATION (RFID) TAG LAMINATION PROCESS USING LINER Public/Granted day:2008-12-18

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备