Aerodynamic jetting of aerosolized fluids for fabrication of passive structures

Invention Grant

US07674671B2 Aerodynamic jetting of aerosolized fluids for fabrication of passive structures 有权

Title translation: 用于制造被动结构的雾化流体的气动喷射

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Patent Title: Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
Patent Title (中): 用于制造被动结构的雾化流体的气动喷射
Application No.: US11302481

Application Date: 2005-12-12
Publication No.: US07674671B2

Publication Date: 2010-03-09
Inventor: Michael J. Renn , Marcelino Essien , Bruce H. King , Jason A. Paulsen
Applicant: Michael J. Renn , Marcelino Essien , Bruce H. King , Jason A. Paulsen
Applicant Address: US NM Albuquerque
Assignee: Optomec Design Company
Current Assignee: Optomec Design Company
Current Assignee Address: US NM Albuquerque
Agency: Peacock Myers, P.C.
Agent Philip D. Askenazy
Main IPC: H01L21/8234
IPC: H01L21/8234

Aerodynamic jetting of aerosolized fluids for fabrication of passive structures

Abstract:

Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters.

Abstract(Chinese):

用于在一种或多种物理，电学，化学或光学性质中直接写入具有5％或更小的公差的被动结构的方法和装置。本装置能够延长沉积时间。该装置可以被配置为无辅助操作，并且使用传感器和反馈回路来检测系统的物理特性以识别和维持最佳过程参数。

Public/Granted literature

US20060163570A1 Aerodynamic jetting of aerosolized fluids for fabrication of passive structures Public/Granted day:2006-07-27

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺