Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11638111Application Date: 2006-12-12
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Publication No.: US07674681B2Publication Date: 2010-03-09
- Inventor: Woong Je Sung
- Applicant: Woong Je Sung
- Applicant Address: KR Seoul
- Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: The Law Offices of Andrew D. Fortney
- Agent Andrew D. Fortney; William K. Nelson
- Priority: KR10-2005-0132655 20051228
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
Disclosed are a semiconductor device and a method for manufacturing the same. The semiconductor device includes a semiconductor substrate including first and second well areas doped with second conductive ions, a third well area in the first well and doped with the second conductive ions, a base area in the third well and doped with first conductive ions, an emitter area in the third well and doped with the second conductive ions, an emitter electrode on the emitter area, a first contact plug in contact with the emitter electrode, a second contact plug in contact with the base area, a collector area in the second well and doped with the second conductive ions, and a third contact plug in contact with the collector area.
Public/Granted literature
- US20070145531A1 Semiconductor device and method for manufacturing the same Public/Granted day:2007-06-28
Information query
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