Invention Grant
- Patent Title: Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process
- Patent Title (中): 使用受控切割工艺在板上制造多个平铺区域的方法和结构
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Application No.: US11191464Application Date: 2005-07-27
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Publication No.: US07674687B2Publication Date: 2010-03-09
- Inventor: Francois J. Henley
- Applicant: Francois J. Henley
- Applicant Address: US CA San Jose
- Assignee: Silicon Genesis Corporation
- Current Assignee: Silicon Genesis Corporation
- Current Assignee Address: US CA San Jose
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
A reusable transfer substrate member for forming a tiled substrate structure. The member including a transfer substrate, which has a surface region. The surface region comprises a plurality of donor substrate regions. Each of the donor substrate regions is characterized by a donor substrate thickness and a donor substrate surface region. Each of the donor substrate regions is spatially disposed overlying the surface region of the transfer substrate. Each of the donor substrate regions has the donor substrate thickness without a definable cleave region.
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