Invention Grant
- Patent Title: Treatment solution and method of applying a passivating layer
- Patent Title (中): 处理溶液和施加钝化层的方法
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Application No.: US11914878Application Date: 2005-05-25
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Publication No.: US07674725B2Publication Date: 2010-03-09
- Inventor: Janos Farkas , Sebastien Petitdidier
- Applicant: Janos Farkas , Sebastien Petitdidier
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- International Application: PCT/EP2005/006501 WO 20050525
- International Announcement: WO2006/125461 WO 20061130
- Main IPC: H01L21/31
- IPC: H01L21/31
Abstract:
A treatment solution for a semiconductor wafer comprising water, a passivating reagent and a surfactant. The treatment solution is either mixed with a cleaning fluid, a rinsing fluid or a drying vapor, and is used in a cleaning apparatus employing a Marangoni dryer.
Public/Granted literature
- US20080194116A1 Treatment Solution and Method of Applying a Passivating Layer Public/Granted day:2008-08-14
Information query
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