Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.