A random copolymer having improved mechanical toughness and properties suitable for thin wall thermoforming applications is provided. The random copolymer exhibits the following physical properties: a flexural modulus profile having a 2% flexural modulus of about 168,000 psi, a 1% flexural modulus of about 190,000 psi, and a 0.4% flexural modulus of about 199,000 psi; a melt flow rate of at least about 2.0 g/10 min.; and a haze of less than about 40%. The random copolymer preferably comprises a copolymer of ethylene and propylene, wherein the ethylene content is in the range of from about 0.2% to about 0.8% ethylene by weight of the copolymer. The random copolymer also preferably includes a stabilizer and a clarifying agent such as a sorbitol based clarifier or a nucleator. Various articles of manufacture such as thermoformed containers and packaging may be formed from the random copolymer.