Invention Grant
- Patent Title: Wire holder
- Patent Title (中): 电线架
-
Application No.: US12185894Application Date: 2008-08-05
-
Publication No.: US07674983B2Publication Date: 2010-03-09
- Inventor: Tatsuya Nakamura
- Applicant: Tatsuya Nakamura
- Applicant Address: JP Aichi-Ken
- Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee: Kitagawa Industries Co., Ltd.
- Current Assignee Address: JP Aichi-Ken
- Agency: Davis & Bujold, P.L.L.C.
- Priority: JP2007-210287 20070810
- Main IPC: H01B17/16
- IPC: H01B17/16

Abstract:
A wire holder includes a synthetic resin component that includes a clamp portion for holding at least one wire and a metal component that includes at least one lead portion mounted on a circuit board. The synthetic resin component includes a groove-shaped fitting groove portion. The metal component includes at least one fitting portion that fits the fitting groove portion and is connected to the lead portion. The fitting groove portion includes at least one first opening portion which allows the at least one lead portion to project in a predetermined direction when the at least one fitting portion fits the fitting groove portion. At least one of end portions in an extension direction of a groove of the fitting groove portion is opened as a second opening portion which allows one of the at least one lead portion to project along the extension direction of the groove of the fitting groove portion.
Public/Granted literature
- US20090038824A1 WIRE HOLDER Public/Granted day:2009-02-12
Information query