Invention Grant
- Patent Title: Printed wiring board assembly, method of mounting components on printed wiring board and electronic apparatus
- Patent Title (中): 印刷电路板组件，印刷电路板和电子设备上组件的安装方法
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Application No.: US12128484Application Date: 2008-05-28
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Publication No.: US07674985B2Publication Date: 2010-03-09
- Inventor: Keiko Kaji
- Applicant: Keiko Kaji
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2007-140343 20070528
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
According to one embodiment, there is provided a printed wiring board assembly composed of a printed wiring board having a first component mounting portion provided on one surface of the printed wiring board, a second component mounting portion provided on the other surface of the printed wiring board having the second component mounting portion overlapped partially with the first component mounting portion, a large-scaled ball grid array component mounted on the first component mounting portion, a circuit component mounted on the second component mounting portion, and a supplementary component which is provided on the second component mounting portion of the printed wiring board having a first portion functioning as a heat-sink to remove heat generated from the circuit component and a second portion functioning as a reinforcement portion to reinforce the first component mounting portion.
Public/Granted literature
Information query
