Invention Grant
US07675000B2 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
失效
使用接近技术的干式，干式，低缺陷激光切割的系统方法和装置
- Patent Title: System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
- Patent Title (中): 使用接近技术的干式，干式，低缺陷激光切割的系统方法和装置
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Application No.: US11016381Application Date: 2004-12-16
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Publication No.: US07675000B2Publication Date: 2010-03-09
- Inventor: John M. Boyd , Fred C. Redeker
- Applicant: John M. Boyd , Fred C. Redeker
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla & Gencarella, LLP
- Main IPC: B23K26/14
- IPC: B23K26/14 ; B23K26/16
Abstract:
A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described.
Public/Granted literature
- US20060088982A1 System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology Public/Granted day:2006-04-27
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