Invention Grant
- Patent Title: Manufacturing method of thin film transistor array substrate
- Patent Title (中): 薄膜晶体管阵列基板的制造方法
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Application No.: US12256456Application Date: 2008-10-22
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Publication No.: US07675088B2Publication Date: 2010-03-09
- Inventor: Jun-Yao Huang , Kuang-Cheng Fu , Jen-Chieh Lin , Chin-Lung Yeh
- Applicant: Jun-Yao Huang , Kuang-Cheng Fu , Jen-Chieh Lin , Chin-Lung Yeh
- Applicant Address: TW Taoyuan
- Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW95132726A 20060905
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A thin film transistor array substrate and the manufacturing method thereof are disclosed herein. A first patterned metal layer, an insulating layer, a patterned layer, and a second patterned metal layer are sequentially formed on a substrate. Then, a number of scan lines and a number of source lines are disposed on the substrate and define a number of pixel regions. A number of the storage capacitance lines are disposed on the substrate in a direction extending along the scan lines and across the pixel regions, wherein each of the storage capacitance lines is essentially perpendicular to each of the source lines and to form a cross portion. A number of patterned thin films are disposed on the storage capacitance lines and above the cross portion.
Public/Granted literature
- US20090061553A1 MAUNFACTURING METHOD OF THIN FILM TRANSISTOR ARRAY SUBSTRATE Public/Granted day:2009-03-05
Information query
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