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US07675096B2 Solid-state image pickup element and method of producing the same 失效
固体摄像元件及其制造方法

Solid-state image pickup element and method of producing the same
Abstract:
A solid-state image pickup element comprises: a semiconductor substrate; an imaging section comprising a photoelectric converting portion, formed on the semiconductor substrate; an intralayer lens formed in an upper layer of the imaging section; and a peripheral circuit section that processes an output of the imaging section, formed on the semiconductor substrate, wherein at least part of the intralayer lens is formed in a lower layer of a wiring portion in the peripheral circuit section.
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