There is provided an imager package including an image sensor die attached to a transparent substrate such that sensitive image sensing components on the sensor die face the transparent substrate. In accordance with an embodiment of the present technique, the imager package may be coupled to an external package via bond wires and other interconnect elements. The sensor die and bond wires may be protected by an encapsulant on which the interconnect elements may be disposed. The bond wires may enable placement of the interconnect elements partially or directly above the sensor die, as opposed to around an outer periphery of the sensor die. There is further provided a method of manufacturing an imager package wherein interconnect elements may be located partially or directly above the sensor die, enabling the manufacture of smaller imager packages than previously envisioned.