A base substrate for chip scale package includes a carrier member made of electrical conductive metals with a first through opening; an active member laminated by a base layer made of electrical conductive metal and an intermediate layer made of electrical insulating or dielectric material, the active member having a through opening with a diameter larger that the diameter of the through opening of the base metal member; the active member being coupled with the carrier member in such a way that the intermediate layer is adhered to an upper surface of the carrier member, and these through openings are aligned to define a shoulder around the through opening of the base metal plate.