Invention Grant
- Patent Title: Semiconductor device with wirings having varying lengths
- Patent Title (中): 具有不同长度的布线的半导体器件
-
Application No.: US11317028Application Date: 2005-12-27
-
Publication No.: US07675161B2Publication Date: 2010-03-09
- Inventor: Koji Hashimoto , Eiji Ito , Tetsuya Kamigaki , Hideyuki Kinoshita
- Applicant: Koji Hashimoto , Eiji Ito , Tetsuya Kamigaki , Hideyuki Kinoshita
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2004-378179 20041227
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/4763 ; H05K1/11
Abstract:
A semiconductor device comprising a plurality of first wirings provided in a predetermined layer on a substrate with being lined up, and formed to extend longer or contract shorter from one side toward the other side along a direction in which the first wirings are lined up, adjacent one-end portions of the first wirings being arranged in positions displaced from one another in a direction crossing at right angles the direction in which the first wirings are lined up.
Public/Granted literature
- US20060194429A1 Semiconductor device and method of manufacturing the same Public/Granted day:2006-08-31
Information query
IPC分类:
