Invention Grant
US07675164B2 Method and structure for connecting, stacking, and cooling chips on a flexible carrier 有权
在柔性载体上连接,堆叠和冷却芯片的方法和结构

Method and structure for connecting, stacking, and cooling chips on a flexible carrier
Abstract:
A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease.
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