Invention Grant
US07675164B2 Method and structure for connecting, stacking, and cooling chips on a flexible carrier
有权
在柔性载体上连接,堆叠和冷却芯片的方法和结构
- Patent Title: Method and structure for connecting, stacking, and cooling chips on a flexible carrier
- Patent Title (中): 在柔性载体上连接,堆叠和冷却芯片的方法和结构
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Application No.: US11682363Application Date: 2007-03-06
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Publication No.: US07675164B2Publication Date: 2010-03-09
- Inventor: Gerald Keith Bartley , Darryl John Becker , Paul Eric Dahlen , Philip Raymond Germann , Andrew Benson Maki , Mark Owen Maxson
- Applicant: Gerald Keith Bartley , Darryl John Becker , Paul Eric Dahlen , Philip Raymond Germann , Andrew Benson Maki , Mark Owen Maxson
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Robert R. Williams
- Main IPC: H01L23/367
- IPC: H01L23/367

Abstract:
A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease.
Public/Granted literature
- US20080218974A1 Method and Structure for Connecting, Stacking, and Cooling Chips on a Flexible Carrier Public/Granted day:2008-09-11
Information query
IPC分类: