Invention Grant
- Patent Title: Printed circuit board, mounting method of electronic component, and electronic apparatus
- Patent Title (中): 印刷电路板，电子部件的安装方法和电子设备
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Application No.: US12146329Application Date: 2008-06-25
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Publication No.: US07675172B2Publication Date: 2010-03-09
- Inventor: Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
- Applicant: Minoru Takizawa , Kuniyasu Hosoda , Takahisa Funayama
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2007-173365 20070629
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.
Public/Granted literature
- US20090001575A1 Printed Circuit Board, Mounting Method of Electronic Component, and Electronic Apparatus Public/Granted day:2009-01-01
Information query
IPC分类:
