Invention Grant
US07675297B1 Methods for measuring bounding corrosion rates using coupled multielectrode sensors and eliminating the effects of bad electrodes
有权
使用耦合的多电极传感器测量界限腐蚀速率并消除不良电极的影响的方法
- Patent Title: Methods for measuring bounding corrosion rates using coupled multielectrode sensors and eliminating the effects of bad electrodes
- Patent Title (中): 使用耦合的多电极传感器测量界限腐蚀速率并消除不良电极的影响的方法
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Application No.: US11888823Application Date: 2007-08-02
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Publication No.: US07675297B1Publication Date: 2010-03-09
- Inventor: Xiaodong Sun Yang , Lietai Yang
- Applicant: Xiaodong Sun Yang , Lietai Yang
- Main IPC: G01R27/08
- IPC: G01R27/08 ; G01N17/04
Abstract:
The bounding corrosion rate is measured with a coupled multielectrode array sensor by decoupling a select number of anodic electrodes on the sensor from the coupling joint. In doing so, all or most of the electrons produced on the anodic electrode that remains connected to the coupling joint are forced to flow to the coupling joint and are thus measured. Because of the large number of electrodes on a multielectrode array sensor, one of them may become contaminated by foreign materials during the measurements or polishing process. The effect of such an electrode on the performance of the sensor can be eliminated by automatically disconnecting it from the coupling joint.
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