Invention Grant
- Patent Title: Probing system for integrated circuit device
- Patent Title (中): 集成电路设备探测系统
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Application No.: US12424969Application Date: 2009-04-16
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Publication No.: US07675309B2Publication Date: 2010-03-09
- Inventor: Cheng Wen Wu , Chih Tsun Huang , Yu Tsao Hsing
- Applicant: Cheng Wen Wu , Chih Tsun Huang , Yu Tsao Hsing
- Applicant Address: TW Hsinchu
- Assignee: National Tsing Hua University
- Current Assignee: National Tsing Hua University
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/28

Abstract:
A probing system for integrated circuit device, which transmits testing data/signal between an automatic test equipment (ATE) and an integrated circuit device, is disclosed. The probing system comprising a test head having a first transceiving module; a test station having a test unit couple to the test head to perform test operation; a communication module having a second transceiving module configured to exchange data with the first transceiving module; an integrated circuit device having at least one core circuit being tested; and at least one test module having a self-test circuit couple to the core circuit and the communication module for performing the core circuit self-testing.
Public/Granted literature
- US20090201039A1 PROBING SYSTEM FOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2009-08-13
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