Invention Grant
- Patent Title: Electronic circuit board
- Patent Title (中): 电子电路板
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Application No.: US11148444Application Date: 2005-06-09
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Publication No.: US07675401B2Publication Date: 2010-03-09
- Inventor: Ka Wai Eric Cheng , Chak Yin Tang
- Applicant: Ka Wai Eric Cheng , Chak Yin Tang
- Applicant Address: HK Kowloon
- Assignee: The Hong Kong Polytechnic University
- Current Assignee: The Hong Kong Polytechnic University
- Current Assignee Address: HK Kowloon
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: H01C1/012
- IPC: H01C1/012
Abstract:
A circuit board, for an electronic circuit having a passive circuit component, has a component region, a non-component region, and circuit wiring conductors on its surface. The component region includes a polymer composition comprising a mixture of polymer resin and filler material that, in combination with the circuit wiring conductors, forms the passive circuit component.
Public/Granted literature
- US20050263321A1 Electronic circuit board Public/Granted day:2005-12-01
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