Invention Grant
- Patent Title: Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
- Patent Title (中): 基板膜厚测定方法，基板膜厚测定装置及基板处理装置
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Application No.: US12222631Application Date: 2008-08-13
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Publication No.: US07675634B2Publication Date: 2010-03-09
- Inventor: Toshifumi Kimba , Shunsuke Nakai
- Applicant: Toshifumi Kimba , Shunsuke Nakai
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP1999-353693 19991213; JP2000-315212 20001016
- Main IPC: G01B11/06
- IPC: G01B11/06
Abstract:
A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.
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