For providing a recording/reproducing apparatus, for recording/reproducing information through conduction of electricity upon contact of a probe, having large recording density and a large transfer speed, but less in deterioration of a probe chips thereof, and being long in the lifetime thereof, within the recording/reproducing apparatus, a multi-chip is formed, disposing probe chips in large numbers thereof at a tip of a cantilever, while the cantilever is of a double-sided beam type, and the multi-chip is disposed at a center of the beam, wherein recording/reproducing portions of the multi-chip are disposed to correspond to recording dots one by one, and the multi-chip forming surface is moved up and down in parallel with the surface of a recording medium, due to suction force, so as to bring it to be in contact with the recording dots, and electricity is conducted after the contact thereof, thereby conducting the recording, in the structure; wherein, since a large amount of data can be read/written at one time, therefore it is possible to improve data transfer speed. Also, with conducting the R/W by means of the multi-chip, comparing to the single chip, it is possible to reduce the traveling distance of the multi-chip, thereby to reduce the abrasion. Also, since the tip portion of the said chip has the curvature radius, being large, such as, equal to 50 nm or greater than that, and since it moves in parallel with the surface of the recording medium, it can be in contact with the surface under the condition of, not the point contact, but near to the plane contact, therefore, the abrasion can be further reduced, effectively.