Invention Grant
US07676078B2 Inspection method, processor and method for manufacturing a semiconductor device
失效
用于制造半导体器件的检查方法,处理器和方法
- Patent Title: Inspection method, processor and method for manufacturing a semiconductor device
- Patent Title (中): 用于制造半导体器件的检查方法,处理器和方法
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Application No.: US10776591Application Date: 2004-02-12
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Publication No.: US07676078B2Publication Date: 2010-03-09
- Inventor: Kazuya Fukuhara
- Applicant: Kazuya Fukuhara
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2003-035383 20030213
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01B11/00 ; H01L21/00 ; G03C5/00

Abstract:
An inspection method for an illumination optical system of an exposure tool includes coating a surface of an exposure target substrate with a resist film; placing a plurality of imaging components deviating from an optical conjugate plane of a surface of the resist film; generating a plurality of inspection patterns of the resist film having a plurality of openings, by projecting exposure beams output from a plurality of effective light sources onto the resist film via the imaging components; measuring one of the inspection patterns as a reference image, and processing the reference image so as to provide reference image data; and determining an abnormal inspection image by measuring inspection images of the inspection patterns and comparing a plurality of inspection image data provided by processing the inspection images with the reference image data.
Public/Granted literature
- US20050031974A1 Inspection method, processor and method for manufacturing a semiconductor device Public/Granted day:2005-02-10
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