Invention Grant
US07677014B2 Method for packaging a photosensitive film roll, resin case therefor, method for recovering and reusing the case, and photosensitive film roll package and method for conveying the same
失效
用于包装感光膜卷的方法，用于其的树脂壳体，用于回收和重复使用壳体的方法以及感光膜卷包装及其传送方法
- Patent Title: Method for packaging a photosensitive film roll, resin case therefor, method for recovering and reusing the case, and photosensitive film roll package and method for conveying the same
- Patent Title (中): 用于包装感光膜卷的方法，用于其的树脂壳体，用于回收和重复使用壳体的方法以及感光膜卷包装及其传送方法
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Application No.: US12035233Application Date: 2008-02-21
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Publication No.: US07677014B2Publication Date: 2010-03-16
- Inventor: Yoshihiro Watanabe , Katsutoshi Itagaki , Tomoyuki Haga , Hideaki Tagaya
- Applicant: Yoshihiro Watanabe , Katsutoshi Itagaki , Tomoyuki Haga , Hideaki Tagaya
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP2000-398153 20001227
- Main IPC: B65B63/04
- IPC: B65B63/04 ; B65B11/58
Abstract:
A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.
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