Invention Grant
- Patent Title: Bumper absorber
- Patent Title (中): 缓冲器
-
Application No.: US12038244Application Date: 2008-02-27
-
Publication No.: US07677616B2Publication Date: 2010-03-16
- Inventor: Takahiko Taniguchi , Seiho Yonezawa , Soshi Mitsuyama , Hiroyasu Miyamoto
- Applicant: Takahiko Taniguchi , Seiho Yonezawa , Soshi Mitsuyama , Hiroyasu Miyamoto
- Applicant Address: JP Nagoya-shi JP Toyota-shi
- Assignee: Hayashi Telempu Co., Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Hayashi Telempu Co., Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi JP Toyota-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-051415 20070301
- Main IPC: B60R19/34
- IPC: B60R19/34

Abstract:
A bumper absorber includes an upper leg and a lower leg, each of which extends in a longitudinal direction of an automobile, and a spanning portion. The spanning portion connects the upper leg and the lower leg, and faces an outer surface side of the bumper absorber in a longitudinal direction of the automobile. Each of the upper leg and the lower leg includes a buckling inductive portion that serves as a starting point of the buckling that is caused when the spanning portion receives an impact load. The buckling inductive portion is formed as an angular transition portion in which the angle of inclination between inner side surfaces changes. The inner side surfaces mutually face between the upper leg and the lower leg that include the buckling inductive portion.
Public/Granted literature
- US20080217936A1 BUMPER ABSORBER Public/Granted day:2008-09-11
Information query