Invention Grant
- Patent Title: Cutting implement
- Patent Title (中): 切割工具
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Application No.: US11801548Application Date: 2007-05-10
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Publication No.: US07677843B2Publication Date: 2010-03-16
- Inventor: Anja Techel , Joseph Dillon
- Applicant: Anja Techel , Joseph Dillon
- Applicant Address: DE Munich IE Athlone
- Assignee: Fraunhofer-Gesellschaft Zur Forderung der Angewandten Forschung E.V.,Lund International
- Current Assignee: Fraunhofer-Gesellschaft Zur Forderung der Angewandten Forschung E.V.,Lund International
- Current Assignee Address: DE Munich IE Athlone
- Agency: Van Dyke, Gardner, Linn & Burkhart, LLP
- Priority: IES2006/0372 20060510
- Main IPC: B23B27/00
- IPC: B23B27/00 ; E02F3/76

Abstract:
A cutting implement comprises a substrate having a cutting edge, and plurality of hardfacing beads deposited on the substrate transverse to the edge of said substrate.
Public/Granted literature
- US20070261867A1 Cutting implement Public/Granted day:2007-11-15
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