Invention Grant
- Patent Title: Compositions and methods for dielectric CMP
- Patent Title (中): 电介质CMP的组成和方法
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Application No.: US10142681Application Date: 2002-05-10
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Publication No.: US07677956B2Publication Date: 2010-03-16
- Inventor: Phillip Carter , Gregory H Bogush , Farhana Khan , Timothy P Johns , Robert Vacassy
- Applicant: Phillip Carter , Gregory H Bogush , Farhana Khan , Timothy P Johns , Robert Vacassy
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas E. Omholt; Caryn Borg-Breen; Frank J. Koszyk
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B7/19 ; B24B7/30 ; B24B7/22
Abstract:
The invention is directed to a chemical-mechanical polishing composition comprising (a) an abrasive consisting essentially of aggregated silica, (b) an acid, and (c) a liquid carrier, wherein the polishing composition has a pH of about 5 or less. The invention is also directed to a method of polishing a substrate comprising a dielectric layer using the polishing composition.
Public/Granted literature
- US20030211815A1 Compositions and methods for dielectric CMP Public/Granted day:2003-11-13
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