Invention Grant
- Patent Title: Embossing roll and embossed substrate
- Patent Title (中): 压花辊和压花基板
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Application No.: US10748650Application Date: 2003-12-30
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Publication No.: US07678034B2Publication Date: 2010-03-16
- Inventor: Lee Delson Wilhelm
- Applicant: Lee Delson Wilhelm
- Applicant Address: US WI Neenah
- Assignee: Kimberly-Clark Worldwide, Inc.
- Current Assignee: Kimberly-Clark Worldwide, Inc.
- Current Assignee Address: US WI Neenah
- Agent Gregory E. Crott; Scott A. Baum
- Main IPC: A01B29/04
- IPC: A01B29/04
Abstract:
An apparatus including a surface containing at least one embossing element. The embossing element having a first sidewall angle and a second sidewall angle and wherein the first sidewall angle is different than the second sidewall angle.
Public/Granted literature
- US20050138981A1 Embossing roll and embossed substrate Public/Granted day:2005-06-30
Information query
