Invention Grant
US07678055B2 Ultrasonic probe with a conductive substrate connected to a transducer
失效
超声波探头具有导电基板连接到换能器
- Patent Title: Ultrasonic probe with a conductive substrate connected to a transducer
- Patent Title (中): 超声波探头具有导电基板连接到换能器
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Application No.: US10784187Application Date: 2004-02-24
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Publication No.: US07678055B2Publication Date: 2010-03-16
- Inventor: Masaaki Sudo , Susumu Hiki , Shinichi Sato , Taihei Sato
- Applicant: Masaaki Sudo , Susumu Hiki , Shinichi Sato , Taihei Sato
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-046515 20030224
- Main IPC: A61B8/00
- IPC: A61B8/00
Abstract:
A piezoelectric transducer for sending and receiving an ultrasonic wave and an FPC for applying current to the piezoelectric transducer is provided, the FPC is arranged oppositely to a side face of the piezoelectric transducer, and a soldering material for electrically connecting the piezoelectric transducer to the FPC is arranged in a corner portion formed by the piezoelectric transducer and the FPC.
Public/Granted literature
- US20040167405A1 Ultrasonic probe and method for fabricating the probe Public/Granted day:2004-08-26
Information query
