Invention Grant
US07678226B2 Method and apparatus for an improved bellows shield in a plasma processing system
有权
用于等离子体处理系统中改进的波纹管屏蔽的方法和装置
- Patent Title: Method and apparatus for an improved bellows shield in a plasma processing system
- Patent Title (中): 用于等离子体处理系统中改进的波纹管屏蔽的方法和装置
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Application No.: US11671282Application Date: 2007-02-05
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Publication No.: US07678226B2Publication Date: 2010-03-16
- Inventor: Hidehito Saigusa , Taira Takase , Kouji Mitsuhashi , Hiroyuki Nakayama
- Applicant: Hidehito Saigusa , Taira Takase , Kouji Mitsuhashi , Hiroyuki Nakayama
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C16/00
Abstract:
The present invention presents an improved bellows shield for a plasma processing system, wherein the design and fabrication of the bellows shield coupled to a substrate holder electrode advantageously provides protection of a bellows with substantially minimal erosion of the bellows shield.
Public/Granted literature
- US20070125494A1 METHOD AND APPARATUS FOR AN IMPROVED BELLOWS SHIELD IN A PLASMA PROCESSING SYSTEM Public/Granted day:2007-06-07
Information query
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