Invention Grant
- Patent Title: Black conductive thick film compositions, black electrodes, and methods of forming thereof
- Patent Title (中): 黑色导电厚膜组合物，黑色电极及其形成方法
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Application No.: US12072999Application Date: 2008-02-29
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Publication No.: US07678296B2Publication Date: 2010-03-16
- Inventor: Ji-Yeon Lee , Michael F. Barker , Keiichiro Hayakawa , Hisashi Matsumo , Hiroaki Noda , Jerome David Smith
- Applicant: Ji-Yeon Lee , Michael F. Barker , Keiichiro Hayakawa , Hisashi Matsumo , Hiroaki Noda , Jerome David Smith
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01B1/02 ; G03C3/00 ; G03C11/00
Abstract:
This invention is directed to black conductive compositions, black electrodes made from such compositions and methods of forming such electrodes. In particular, the invention is directed to a single layer bus electrode.
Public/Granted literature
- US20080224102A1 Black conductive thick film compositions, black electrodes, and methods of forming thereof Public/Granted day:2008-09-18
Information query
