Invention Grant
- Patent Title: Plasma spraying method
- Patent Title (中): 等离子喷涂法
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Application No.: US10509850Application Date: 2003-03-18
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Publication No.: US07678428B2Publication Date: 2010-03-16
- Inventor: Gerard Barbezat , Arno Refke , Michael Loch
- Applicant: Gerard Barbezat , Arno Refke , Michael Loch
- Applicant Address: CH Wohlen
- Assignee: Sulzer Metco AG
- Current Assignee: Sulzer Metco AG
- Current Assignee Address: CH Wohlen
- Agency: Townsend and Townsend and Crew, LLP
- International Application: PCT/CH03/00175 WO 20030318
- International Announcement: WO03/087422 WO 20031023
- Main IPC: C23C4/10
- IPC: C23C4/10 ; C23C4/12 ; H05H1/24 ; H05H1/26

Abstract:
A method of forming a thermally insulating layer system on a metallic substrate surface is disclosed. The method includes: forming a plasma beam; introducing a coating material in the form of a powder having particles in the range between 1 and 50 μm, carried by a delivery gas into the plasma beam, so as to form a powder beam; defocusing the powder beam by using the plasma beam with a sufficiently high specific enthalpy and by maintaining a process pressure between 50 and 2000 Pa for at least partially melting and vaporizing at least 5% by weight of the powder, so as to form a vapor phase cloud; and forming from the vapor phase cloud onto the metallic substrate surface an insulating layer, being a part of the insulating layer system, having an anisotropic columnar microstructure having elongate particles; wherein the anisotropic columnar microstructure is aligned substantially perpendicular to the metallic substrate surface and low-density transition regions with little material delimit the elongate particles relative to one another.
Public/Granted literature
- US20050129965A1 Plasma injection method Public/Granted day:2005-06-16
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