Invention Grant
US07678514B2 Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these films
失效
正型感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体器件以及使用这些膜的显示装置
- Patent Title: Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these films
- Patent Title (中): 正型感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体器件以及使用这些膜的显示装置
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Application No.: US12343983Application Date: 2008-12-24
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Publication No.: US07678514B2Publication Date: 2010-03-16
- Inventor: Hiromichi Sugiyama , Toshio Banba , Shusaku Okamyo
- Applicant: Hiromichi Sugiyama , Toshio Banba , Shusaku Okamyo
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-335975 20071227; JP2008-094632 20080401
- Main IPC: G03F7/023
- IPC: G03F7/023 ; G03F7/30
Abstract:
A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, and R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.
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