Invention Grant
- Patent Title: Magnetoresistive sensor module and method of manufacturing the same
- Patent Title (中): 磁阻传感器模块及其制造方法
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Application No.: US11538663Application Date: 2006-10-04
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Publication No.: US07678585B2Publication Date: 2010-03-16
- Inventor: Juergen Zimmer
- Applicant: Juergen Zimmer
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Eschweiler & Associates, LLC
- Priority: DE102005047482 20051004
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A composite arrangement has a substrate material with a main surface, a metal-insulator arrangement including a metal sheet with an insulation area on the main surface, and a magnetoresistive structure on the metal-insulator arrangement. Thereupon, a cover layer arrangement is heated, so that the same at least partially covers the magnetoresistive structure with a target thickness D, and finally the magnetoresistive structure is heated by light radiation with given wavelength λ. The absorbed portion of the emitted radiation depends on the actual thickness D′ of the cover layer arrangement and the wavelength λ, wherein the target thickness D of the cover layer arrangement is adjusted so that, if the cover layer deviates from the target thickness D in a range of ±20% with reference to the target thickness D, a change of the absorbed portion of the emitted radiation in the magnetoresistive structure of less than ±40% is caused.
Public/Granted literature
- US20070264422A1 Magnetoresistive sensor module and method of manufacturing the same Public/Granted day:2007-11-15
Information query
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