Invention Grant
- Patent Title: Method for manufacturing surface-emitting semiconductor laser
- Patent Title (中): 表面发射半导体激光器的制造方法
-
Application No.: US11556595Application Date: 2006-11-03
-
Publication No.: US07678598B2Publication Date: 2010-03-16
- Inventor: Toshihiko Baba , Atsushi Matsuzono , Akio Furukawa , Satoshi Sasaki , Mitsunari Hoshi
- Applicant: Toshihiko Baba , Atsushi Matsuzono , Akio Furukawa , Satoshi Sasaki , Mitsunari Hoshi
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Toshihiko Baba
- Current Assignee: Sony Corporation,Toshihiko Baba
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2003-367741 20031028; JPP2004-136295 20040430
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for manufacturing a surface-emitting semiconductor laser having a structure in which the single horizontal mode of high power is stably maintained is provided. A scattering-loss-structure portion composed of a low refractive-index region is disposed around a main current path in a surface-emitting semiconductor laser, namely around a cavity structure portion; the low refractive-index region is disposed at intervals; and the shape of the tip portion opposing to the center portion is set to be a tapered shape, for example, at an acute angle. Accordingly, in the cavity structure portion, the loss of light-emitting laser of a high-order mode localized in the outer circumferential portion becomes large, so that a surface-emitting semiconductor laser that oscillates the single-mode laser with favorable performance is constructed.
Public/Granted literature
- US20070202622A1 METHOD FOR MANUFACTURING SURFACE-EMITTING SEMICONDUCTOR LASER Public/Granted day:2007-08-30
Information query
IPC分类: