Invention Grant
- Patent Title: Thermal interface material and method for making the same
- Patent Title (中): 热界面材料及其制造方法
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Application No.: US11321140Application Date: 2005-12-29
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Publication No.: US07678614B2Publication Date: 2010-03-16
- Inventor: Hua Huang , Chang-Hong Liu , Shou-Shan Fan
- Applicant: Hua Huang , Chang-Hong Liu , Shou-Shan Fan
- Applicant Address: CN Beijing TW Tu-Cheng, Taipei Hsien
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW Tu-Cheng, Taipei Hsien
- Agent D. Austin Bonderer
- Priority: CN200510033937 20050331
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A thermal interface material (100) includes a macromolecular matrix (10) and a plurality of thermally conductive fibers (20) incorporated therein. The macromolecular matrix (10) has a first surface (11) and an opposite second surface (12). Each of the thermally conductive fibers (20) is substantially parallel to each other and extends between the first and second surfaces (11), (12). A method for manufacturing the thermal interface material includes the steps of: (a) providing a number of thermally conductive fibers; (b) aligning the thermally conductive fibers uniformly and directionally to form an array of the thermally conductive fibers; (c) immersing the array of thermally conductive fibers into a liquid macromolecular material; (d) solidifying the liquid macromolecular material to obtain a macromolecular matrix having the two opposite surfaces with the thermally conductive fibers embedded therein, that is, a desired interface material is obtained.
Public/Granted literature
- US20060219689A1 Thermal interface material and method for making the same Public/Granted day:2006-10-05
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