Invention Grant
- Patent Title: Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit
- Patent Title (中): 热管理方法包括直接在集成散热器上的金属层和集成电路
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Application No.: US12143038Application Date: 2008-06-20
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Publication No.: US07678616B2Publication Date: 2010-03-16
- Inventor: Jiun Hann Sir , Chee Koang Chen
- Applicant: Jiun Hann Sir , Chee Koang Chen
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part. The first metallic layer is directly placed on top of an exterior surface of the ceiling wall of the integrated heat spreader as well as the back surface of the integrated circuit.
Public/Granted literature
- US20080254573A1 INTEGRATED CIRCUIT THERMAL MANAGEMENT METHOD AND APPARATUS Public/Granted day:2008-10-16
Information query
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