Invention Grant
- Patent Title: Metal gated ultra short MOSFET devices
- Patent Title (中): 金属门极超短MOSFET器件
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Application No.: US12198857Application Date: 2008-08-26
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Publication No.: US07678638B2Publication Date: 2010-03-16
- Inventor: Jack Oon Chu , Bruce B. Doris , Meikei Ieong , Jing Wang
- Applicant: Jack Oon Chu , Bruce B. Doris , Meikei Ieong , Jing Wang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent George Sai-Halasz
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
MOSFET devices suitable for operation at gate lengths less than about 40 nm, and methods of their fabrication is being presented. The MOSFET devices include a ground plane formed of a monocrystalline Si based material. A Si based body layer is epitaxially disposed over the ground plane. The body layer is doped with impurities of opposite type than the ground plane. The gate has a metal with a mid-gap workfunction directly contacting a gate insulator layer. The gate is patterned to a length of less than about 40 nm, and possibly less than 20 nm. The source and the drain of the MOSFET are doped with the same type of dopant as the body layer. In CMOS embodiments of the invention the metal in the gate of the NMOS and the PMOS devices may be the same metal.
Public/Granted literature
- US20080318374A1 Metal Gated Ultra Short MOSFET Devices Public/Granted day:2008-12-25
Information query
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