Invention Grant
US07678652B2 MOSFET-type semiconductor device, and method of manufacturing the same
失效
MOSFET型半导体器件及其制造方法
- Patent Title: MOSFET-type semiconductor device, and method of manufacturing the same
- Patent Title (中): MOSFET型半导体器件及其制造方法
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Application No.: US12222146Application Date: 2008-08-04
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Publication No.: US07678652B2Publication Date: 2010-03-16
- Inventor: Masakatsu Tsuchiaki
- Applicant: Masakatsu Tsuchiaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2005-028963 20050204
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A MOSFET-type semiconductor device includes a monocrystalline semiconductor layer formed in a shape of a thin wall on a insulating film, a gate electrode straddling over the semiconductor layer around the middle portion of the wall-shaped semiconductor layer via a gate insulating film, source and drain regions formed at the both ends of the semiconductor layer, a first metal-semiconductor compound layer formed on one of the side walls of each of source and drain regions of the semiconductor layer, and a second metal-semiconductor compound layer having a different composition and Schottky barrier height from that of the first metal-semiconductor compound layer on the other side wall of each of source and drain regions of the semiconductor layer.
Public/Granted literature
- US20080299719A1 MOSFET-type semiconductor device, and method of manufacturing the same Public/Granted day:2008-12-04
Information query
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