Invention Grant
- Patent Title: Crystallization method of amorphous silicon for forming large grain with single pulse laser
- Patent Title (中): 用单脉冲激光形成大晶粒的非晶硅结晶方法
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Application No.: US11430713Application Date: 2006-05-09
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Publication No.: US07678666B2Publication Date: 2010-03-16
- Inventor: Ki Bong Song , Jun Ho Kim
- Applicant: Ki Bong Song , Jun Ho Kim
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Ladas & Parry LLP
- Priority: KR10-2005-0067822 20050726; KR10-2005-0108943 20051115
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
A layer structure comprising substrate, a metal layer, a first amorphous silicon layer, an insulating layer, and a second amorphous silicon layer, and a method of crystallizing the second amorphous silicon layer by irradiating single pulse laser to the layer structure are provided. The method provides an effect of forming large grain of amorphous silicon as good as using dual pulse laser or higher just by using single pulse laser without additional optical system. A semiconductor device employing the layer structure maximizes an electron mobility.
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