A method of bonding an integrated circuit to a substrate is provided. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method comprises the steps of: (a) positioning a substrate at a backside of the integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the integrated circuit; and (c) applying a bonding force from the bonding tool, through the film frame tape and the integrated circuit, onto the substrate.